Rigid transaction card

ABSTRACT

A transaction card can be manufactured from rigid materials, such as glass, stone, or ceramics. First, a rigid layer of a transaction card can be placed within a first recess of a first metallic sheet. The first recess can comprise a lip and an opening. Next, a binding layer can be placed on top of the first rigid layer of the transaction card where the binding layer comprises a binding medium. A second rigid layer can be placed on top of the binding layer. A second metallic sheet can be placed on top of the first metallic sheet where the second metallic sheet has a second recess with a lip and an opening. Next, the first metallic sheet can be fused together with the second metallic sheet to form a fused metal sheet. The fused metal sheet can be cut along a border of the opening of the first recess.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of, and claims priority to and thebenefit of, copending U.S. patent application Ser. No. 17/494,408,entitled “RIGID TRANSACTION CARD” and filed on Oct. 5, 2021, which ishereby incorporated by reference in its entirety.

BACKGROUND

Transaction cards are used for payments in a wide variety of situations.For transaction accounts targeting the upscale or luxury market,companies may offer transaction cards manufactured from non-traditionalmaterials or that have a non-traditional design. This allows formarketing and promoting the transaction account as a premiere or luxuryservice.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present disclosure can be better understood withreference to the following drawings. The components in the drawings arenot necessarily to scale, with emphasis instead being placed uponclearly illustrating the principles of the disclosure. Moreover, in thedrawings, like reference numerals designate corresponding partsthroughout the several views.

FIG. 1 depicts an example of an assembled transaction card according tovarious embodiments of the present disclosure.

FIG. 2 depicts a cross-section view of the transaction card according tovarious embodiments of the present disclosure.

FIG. 3 depicts an exploded view of one example arrangement of thetransaction card.

FIG. 4 depicts an exploded view of one example arrangement of thetransaction card.

FIG. 5 depicts an exploded view of one example arrangement of thetransaction card.

FIG. 6 depicts an exploded view of one example arrangement of thetransaction card.

FIG. 7 is a flowchart that provides an example of the process formanufacturing a transaction card according to various embodiments of thepresent disclosure.

FIGS. 8A and 8B depict examples of a metallic sheet used in themanufacturing process described by the flowchart of FIG. 7

FIGS. 9A-J provide a graphical illustration of the individual portionsof the manufacturing process described by the flowchart of FIG. 7 usingthe metallic sheets illustrated in FIGS. 8A and 8B.

DETAILED DESCRIPTION

Disclosed are various approaches for creating a transaction card usingmultiple layers of rigid materials. The transaction card can beassembled from a number of layers of rigid materials. These layers canbe bound together using a binder or other binding material (e.g., glue,cement, or other adhesive). The edges of the transaction card can beenveloped by rim, such as a metallic band. The binder material and themetallic band can provide structural integrity should one or more of thelayers of rigid materials fracture, crack, or splinter. The rim ormetallic band can also protect the layers of rigid materials fromfracturing, cracking, or splintering in response to an impact (e.g., ifthe transaction card were to fall and land on its edge on a hardsurface).

In the following discussion, a general description of a transaction cardand a method for manufacturing the same is provided. Although thefollowing discussion provides illustrative examples of the variousembodiments of the present disclosure, the use of the followingillustrative examples does not exclude other implementations that areconsistent with the principals disclosed.

FIG. 1 depicts an example of an assembled transaction card 100 accordingto various embodiments of the present disclosure. In this example, thetransaction card 100 is made of several transparent layers, allowing forone to see through the body of the transaction card 100. The transactioncard 100 can have a rim 103 along the edge of the transaction card 100,which can help prevent the transaction card from cracking or shatteringif it is dropped or falls onto a solid surface. The rim 103 can alsoprovide additional structural integrity to the transaction card 100 byholding the layers of the transaction card 100 together. The transactioncard 100 can also include an antenna 106, a processing chip 109, and/ora magnetic stripe 113.

The antenna 106 can be used to provide wireless communications betweenthe processing chip 109 and a contactless payment terminal. The antenna106 can also be used to provide power to the processing chip 109 fromthe payment terminal. In some implementations, the antenna 106 can bephysically coupled to the processing chip 109, while in otherimplementations, the antenna 106 can be inductively coupled to theprocessing chip 109. Although depicted separately from the processingchip 109, in some implementations the antenna can be included in orintegrated within the processing chip 109 to form a single unit.

The processing chip 109 can represent any integrated circuit chip thatcan be used for securing or processing payments using the transactioncard 100. Examples of processing chips 109 include integrated circuitchips that implement various versions of the Europay, Mastercard, andVISA (EMV) standard for smart payment cards. In some implementations,the processing chip 109 is coupled to an antenna 106 to providecontactless payment using near-field communication (NFC), ultrawide band(UWB) or similar low-power, short-range wireless communicationsstandards. However, in other implementations, the processing chip 109can include an integrated antenna 106.

The magnetic stripe 113 can include any band of magnetic materialcapable of storing data. Data stored on the magnetic stripe 113 caninclude information such as an account number of a payment accountassociated with the transaction card 100, the expiration date of thepayment account, a card verification value (CVV) or card verificationcode (CSC), a service code, etc.

FIG. 2 depicts a cross-section view of the transaction card 100,according to various embodiments of the present disclosure. In thiscross-section view, a number of layers are depicted. These layers caninclude an upper rigid layer 203 and a lower rigid layer 206. A bindinglayer 209 sits between the upper rigid layer 203 and the lower rigidlayer 206. The processing chip 109 sits within a pocket 213 on theexterior surface of the upper rigid layer 203, such that the surface ofthe processing chip 109 is flush with the surface of the upper rigidlayer 203. The processing chip 109 can be secured within the pocket 213using any suitable adhesive. The antenna 106 and the magnetic stripe 113can sit within the binding layer 209 between the upper rigid layer 203and the lower rigid layer 206.

The upper rigid layer 203 and the lower rigid layer 206 can be formedfrom a number of rigid materials. For example, the upper rigid layer 203or the lower rigid layer 206 could be formed from a chemicallystrengthened glass that has increased strength as a result of apost-production process. Examples of chemically strengthened glassesinclude glasses marketed under the GORILLA GLASS® trademark, analkali-aluminosilicate glasses, etc. The use of the chemicallystrengthened glasses, when combined with a transparent translucentbinding layer 209, allow for transparent or translucent transactioncards 100 to be manufactured. As another example, the upper rigid layer203 or the lower rigid layer 206 could be formed from a ceramicmaterial, including transparent ceramic materials such as aluminumoxynitride, also known as transparent aluminum. In some implementations,the upper rigid layer 203 or the lower rigid layer 206 could be formedfrom stone, such as black onyx, red onyx, or other stones.

The binding layer 209 is a layer containing a binding medium that bindsthe upper rigid layer 203 to the lower rigid layer 206. The bindinglayer 209 can use any suitable binding medium. Examples of bindingmediums include various types of adhesives, such as glues, laminates,cements, etc. Some binding mediums could be preferred for particularconfigurations. For example, if a transparent or translucent transactioncard 100 is being manufactured using transparent or translucentmaterials for the upper rigid layer 203 and the lower rigid layer 206,then a transparent or translucent glue, glue laminate, or other adhesiveor binding medium could be used. If opaque materials are used for theupper rigid layer 203 or the lower rigid layer 206, then other bindingmediums could be used for the binding layer 209.

The position of the binding layer 209 between the upper rigid layer 203and the lower rigid layer 206 provides additional structural integrityto the transaction card 100. If the transaction card 100 wereconstructed from a single rigid layer, and the single rigid layer wereto crack, shatter, or splinter, then the transaction card 100 couldseparate into multiple pieces. If this were to occur in a person's hand,wallet, or pocket, such separation could pose a safety hazard by cuttingthe individual. Placing a binding layer 209 between the upper rigidlayer 203 and the lower rigid layer 206 allows for the card to remainwhole even if the upper rigid layer 203 or the lower rigid layer 206were to be damaged. For example, rather than shattering, the upper rigidlayer 203 or lower rigid layer 206 would crack but remain adhered to thebinding layer 209.

As shown in the cross-section view of FIG. 2 , the rim 103 extends fromthe exterior surface of the upper rigid layer 203 around the edge of thetransaction card 100 to the exterior surface of the lower rigid layer206. As a result, the rim 103 acts like a clamp to hold the upper rigidlayer 203 and the lower rigid layer 206, preventing the upper rigidlayer 203 and the lower rigid layer 206 from separating from thetransaction card 100 in the event that the binding medium of the bindinglayer 209 fails, which could occur due to wear and tear over the life ofthe transaction card 100. Moreover, the rim 103 acts as a shock absorberin the event that the transaction card 100 is dropped or otherwise fallsand strikes a surface with its edge, thereby preventing the upper rigidlayer 203 or the lower rigid layer 206 from shattering or cracking dueto the impact.

FIG. 3 depicts an exploded view of one example arrangement of thetransaction card 100. Starting at the top of FIG. 3 and proceeding tothe bottom, a processing chip 109 is shown as being placed within apocket 213 on the exterior surface of an upper rigid layer 203. Theprocessing chip 109 can be secured within the pocket 213 using anysuitable adhesive. The antenna 106 can be placed below the upper rigidlayer 203. The antenna 106 can include a coil below the processing chip109, causing the antenna 106 to be inductively coupled to the processingchip 109. The binding layer 209 is located beneath the upper rigid layer203 and the antenna 106. The magnetic stripe 113 can be placed beneaththe binding layer 209. At the bottom is the lower rigid layer 206.Encompassing the upper rigid layer 203 and the lower rigid layer 206 isthe rim 103. Although the rim 103 is depicted as two portions forillustrative purposes, it is understood that the rim 103 is a singlepiece as depicted in the cross-section view of FIG. 2 .

FIG. 4 depicts an exploded view of another example arrangement of thetransaction card 100. Starting at the top of FIG. 4 and proceeding tothe bottom, a processing chip 109 is shown as being placed within apocket 213 on the exterior surface of an upper rigid layer 203. Theprocessing chip 109 can be secured within the pocket 213 using anysuitable adhesive. The bottom of the pocket 213 of the upper rigid layer203 can have a plurality of holes 403. The antenna 106 can be placedbelow the upper rigid layer 203. The antenna 106 can be physicallycoupled to the processing chip 109 by passing a wire through individualones of the holes 403 located at the bottom of the pocket. The bindinglayer 209 is located beneath the upper rigid layer 203 and the antenna106. The magnetic stripe 113 can be placed beneath the binding layer209. At the bottom is the lower rigid layer 206. Encompassing the upperrigid layer 203 and the lower rigid layer 206 is the rim 103. Althoughthe rim 103 is depicted as two portions for illustrative purposes, it isunderstood that the rim 103 is a single piece as depicted in thecross-section view of FIG. 2 .

FIG. 5 depicts an exploded view of another example arrangement of thetransaction card 100. Starting at the top of FIG. 5 and proceeding tothe bottom, a processing chip 109 is shown as being placed within apocket 213 on the exterior surface of an upper rigid layer 203. Theprocessing chip 109 can be secured within the pocket 213 using anysuitable adhesive. In contrast to the examples depicted in FIGS. 3 and 4, an antenna is not placed beneath the upper rigid layer 203. Inexamples such as those depicted in FIG. 5 , the processing chip 109 caninclude an integrated antenna 106. The binding layer 209 is locatedbeneath the upper rigid layer 203 and the antenna 106. The magneticstripe 113 can be placed beneath the binding layer 209. At the bottom isthe lower rigid layer 206. Encompassing the upper rigid layer 203 andthe lower rigid layer 206 is the rim 103. Although the rim 103 isdepicted as two portions for illustrative purposes, it is understoodthat the rim 103 is a single piece as depicted in the cross-section viewof FIG. 2 .

FIG. 6 depicts an exploded view of another example arrangement of thetransaction card 100. Starting at the top of FIG. 6 and proceeding tothe bottom, a processing chip 109 is shown as being placed within apocket 213 on the exterior surface of an upper rigid layer 203. Theprocessing chip 109 can be secured within the pocket 213 using anysuitable adhesive. The bottom of the pocket 213 of the upper rigid layer203 can have a plurality of holes 403. The antenna 106 can be placedbelow the upper rigid layer 203. The antenna 106 can be physicallycoupled to the processing chip 109 by passing a wire through individualones of the holes 403 located at the bottom of the pocket. The bindinglayer 209 is located beneath the upper rigid layer 203 and the antenna106. Beneath binding layer 209 is the lower rigid layer 206. Themagnetic stripe 113 can be placed on the exterior surface of the lowerrigid layer 206. In some implementations, the exterior surface of thelower rigid layer 206 can include a channel 603. In theseimplementations, the magnetic stripe 113 can rest within the channel 603so that the surface of the magnetic stripe 113 is flush with theexterior surface of the lower rigid layer 206. Encompassing the upperrigid layer 203 and the lower rigid layer 206 is the rim 103. Althoughthe rim 103 is depicted as two portions for illustrative purposes, it isunderstood that the rim 103 is a single piece as depicted in thecross-section view of FIG. 2 .

Although FIGS. 3-6 depict examples of implementations according to thevarious embodiments of the present disclosure, other arrangements areincluded within the scope of this disclosure. For example, theimplementations depicted in FIG. 3 or FIG. 5 could be modified to placethe magnetic stripe 113 on the exterior of the transaction card 100instead of between the upper rigid layer 203 and the lower rigid layer206. As another example, the relative positions of the magnetic stripe113, the antenna 106, and the binding layer 209 between the upper rigidlayer 203 and the lower rigid layer 206 could be switched withoutimpacting the functionality of the various embodiments of the presentdisclosure.

Referring next to FIG. 7 , shown is a flowchart that provides an exampleof the process for manufacturing a transaction card 100 according tovarious embodiments of the present disclosure. Although the flowchart ofFIG. 7 shows an example sequence of actions, it is understood that theorder of actions can differ from that which is depicted. For example,the actions depicted by two or more blocks shown in succession can beperformed concurrently or with partial concurrence. As another example,the actions depicted by two or more blocks can be performed inalternative sequences compared to what is depicted. Further, in someembodiments, one or more of the blocks shown in the flowchart of FIG. 7can be skipped or omitted. It is understood that all such variations arewithin the scope of the present disclosure.

Beginning at block 703, the lower rigid layer 206 of a transaction card100 can be placed within a first recess of a first metallic sheet. Themetallic sheet can have a plurality of recesses according to variousembodiments of the present disclosure, allowing for the transaction card100 to be massed produced in an assembly line.

Next, at block 706, a magnetic stripe 113 can be placed on top of thelower rigid layer 206 of the transaction card 100. In someimplementations, the magnetic stripe 113 can be affixed to the lowerrigid layer 206 using an adhesive. In other implementations, themagnetic stripe 113 can have an adhesive backing, causing the magneticstrip 113 to be self-adhering when placed in contact with the lowerrigid layer 206. In some implementations, the placement of the magneticstripe 113 could be omitted (e.g., for embodiments of a transaction card100 that are not manufactured to include the magnetic stripe 113).

Then, at block 709, a binding layer 209 can be placed on top of thelower rigid layer 206. The binding medium that forms the binding layer209 can be deposited using any number of approaches. For example, a glueor similar adhesive could be sprayed on the lower rigid layer 206. Asanother example, an adhesive sheet could be laid on top of the lowerrigid layer 206.

Moving on to block 713, an antenna 106 can be placed on top of thebinding layer 209. This step can be omitted in those embodiments thatuse a processing chip 109 that includes an integrated antenna 106.Moreover, the placement of the antenna at block 713 could occur earlier.For example, the magnetic strip 113 and the antenna 106 could be placedbetween the lower rigid layer 206 and the binding layer 209.

Proceeding to block 716, an upper rigid layer 203 can be placed on topof the antenna 106 and/or the binding layer 209. For example, if antenna106 were not placed on top of the binding layer 209 at block 713 (e.g.,because a processing chip 109 with an integrated antenna 106 were beingused), then the upper rigid layer 203 could be placed directly on top ofthe binding layer 209. As another example, if the antenna 106 wereplaced underneath binding layer 209, then the upper rigid layer 203could be placed directly on top of the binding layer 209. However, if anantenna 106 were previously placed on top of the binding layer 209, thenthe portions of the upper rigid layer 203 would be in contact with theantenna 106 while other portions of the upper rigid layer 203 would bein contact with the binding layer 209, resulting in the upper rigidlayer 203 being placed on top of both the antenna 106 and the bindinglayer 209.

Then, at block 719, a processing chip 109 can be affixed to the upperrigid layer 203. For example, an adhesive could be deposited in thepocket 213 of the upper rigid layer 203. The processing chip 109 couldthen be placed in the pocket 213. The adhesive in the pocket 213 couldthen cause the processing chip 109 to become affixed to the upper rigidlayer 203. In some implementations, placement of the processing chip 109could occur before the fusion of the first metallic sheet with thesecond metallic sheet in order to improve the adherence of theprocessing chip 109 to the upper rigid layer 203 or to cause theprocessing chip 109 to adhere to the upper rigid layer 203. However, inother implementations, affixing the processing chip 109 to the upperrigid layer 203 can occur after the first metallic sheet is fused to thesecond metallic sheet.

Next, at block 723, a second metallic sheet can be placed on top of thefirst metallic sheet, the second metallic sheet having a respectivesecond recess to the first recess of the first metallic sheet. Asdiscussed later, the first metallic sheet and the second metallic sheetcan be fused together to form the rim 103 of the transaction card 100that encompasses all of the layers of the transaction card 100.

Referring next to block 726, the first metallic sheet and the secondmetallic sheet can be fused together to form a fused metallic sheet. Forexample, heat and pressure could be used to fuse the two metallic sheetstogether. The heat and pressure used to fuse the two metallic sheetstogether can also cause the binding medium of the binding layer 209 toadhere the upper rigid layer 203 to the lower rigid layer 206 in thoseimplementations that use a heat or pressure activated binding medium.

Subsequently, at block 729, the fused metallic sheet can be cut alongthe edges of the recess to remove the transaction card 100 while leavingthe rim 103 formed from fusing the metallic sheets at block 726. Cuttingcan be performed using a wide variety of tools, including die cutters,laser cutters, rotary cutters, etc. Once the transaction card 100 is cutfrom the metallic sheet, it can be engraved or embossed as desired bythe issuer of the transaction card 100.

FIG. 8A depicts an example of a metallic sheet 800 used in themanufacturing process described by the flowchart of FIG. 7 . As shown,the metallic sheet 800 can include one or more recesses 803. Each recess803 matches the shape and dimensions of the upper rigid layer 203 and/orlower rigid layer 206 of the transaction card 100. Each recess 803 alsohas a lip 806 that extends over the exterior surface of the upper rigidlayer 203 and/or lower rigid layer 206 when the upper rigid layer 203 orlower rigid layer 206 is placed within the recess 803. The bottom of therecess 803 can form a hollow cavity or opening.

FIG. 8B depicts a second view of the metallic sheet 800 used in themanufacturing process described by the flowchart of FIG. 7 . Here, apartial cross-section showing a recess 803 of the metallic sheet 800 isdepicted according to various embodiments of the present disclosure. Asshown, a recess 803 matches the shape and dimensions of the upper rigidlayer 203 and/or lower rigid layer 206 of the transaction card 100. Therecess 803 also has a lip 806 that extends over the exterior surface ofthe upper rigid layer 203 and/or lower rigid layer 206 when the upperrigid layer 203 or lower rigid layer 206 is placed within the recess803. The bottom of the recess 803 can form a hollow cavity or opening.

FIGS. 9A-9J provide a graphical illustration of the individual portionsof the manufacturing process described by the flowchart of FIG. 7 usingthe metallic sheets 800 illustrated in FIGS. 8A and 8B to produce atransaction card 100.

FIG. 9A shows a first metallic sheet 800 a being placed on a conveyorbelt 900 of an assembly line in an example embodiment of the presentdisclosure. As shown, an industrial robot or machine can place the firstmetallic sheet 800 a on the conveyor belt 900 of the assembly line.

FIG. 9B illustrates an example approach for placing the lower rigidlayer 206 within the recess 803 of a first metallic sheet 800 a, aspreviously described at block 703 of FIG. 7 . As shown, an industrialrobot or machine can place individual lower rigid layers 206 in eachrecess 803 of the first metallic sheet 800 a.

FIG. 9C illustrates an example approach for placing a magnetic stripe113 on top of the lower rigid layer 206, as previously described atblock 706 of FIG. 7 . As depicted, each magnetic stripe 113 isindividually placed by an industrial robot. However, other approachescould be used to apply the magnetic stripe 113, such as rollers.

FIG. 9D illustrates an example approach for placing a binding layer 209on top of the lower rigid layer 206 and the magnetic stripe 113, aspreviously described at block 709 of FIG. 7 . For example, one or moredrops of glue or a similar adhesive could be deposited by an industrialrobot or machine, which would form the binding layer 209 as the glue oradhesive spreads under pressure. As another example, an industrial robotor machine could be used to deposit individual sheets of laminate, gluelaminate, or other adhesive.

FIG. 9E illustrates an example approach for placing an antenna 106 ontop of the binding layer 209, as previously described at block 713 ofFIG. 7 . As illustrated, an industrial robot or machine could lay anantenna 106 on top of the binding layer 209.

FIG. 9F illustrates an example approach for placing the upper rigidlayer 203 on top of the antenna 106 and/or the binding layer 209, aspreviously described at block 716 of FIG. 7 . As shown, an industrialrobot or machine can place individual upper rigid layers 206 on top ofeach antenna 106 and/or binding layer 209.

FIG. 9G illustrates an example of placing a processing chip 109 withinthe pocket 213 of each upper rigid layer 203, as previously described atblock 719 of FIG. 7 . As shown here, each processing chip 109 is placeddirectly within the pocket 213 by an industrial robot or machine withoutfirst depositing an adhesive within the pocket 213. This can be done ifthe processing chip 109 is self-adhering (e.g., because the processingchip 109 has an adhesive on its back). Additional stations along theconveyor belt 900 could be desired if an adhesive is to first bedeposited within the pocket 213.

FIG. 9H illustrates an example of placing a second metallic sheet 800 bon top of the first metallic sheet 800 a, as previously described atblock 723 of FIG. 7 . As shown, an industrial robot or machine can placethe second metallic sheet 800 b on top of the first metallic sheet 800 athe conveyor belt 900 of the assembly line.

FIG. 9I illustrates an example of fusing the first metallic sheet 800 awith the second metallic sheet 800 b, as previously described at block726 of FIG. 7 . As shown, a heat press 903 can be used to apply heatand/or pressure to the metallic sheets 800, the upper rigid layer 203,and the lower rigid layer 206. This can cause the first metallic sheet800 a to fuse with the second metallic sheet 800 b. In someimplementations, this can also cause the binding medium of the bindinglayer 209 to adhere the first metallic sheet 800 a with the secondmetallic sheet 800 b.

FIG. 9J illustrates an example of cutting the fused metallic sheet toremove the individual transaction cards 100, as previously described atblock 729 of FIG. 7 . Although FIG. 9J illustrates the use of cutoutdies, other cutting tools can be used according to various embodimentsof the present disclosure.

Disjunctive language such as the phrase “at least one of X, Y, or Z,”unless specifically stated otherwise, is otherwise understood with thecontext as used in general to present that an item, term, etc., can beeither X, Y, or Z, or any combination thereof (e.g., X; Y; Z; X or Y; Xor Z; Y or Z; X, Y, or Z; etc.). Thus, such disjunctive language is notgenerally intended to, and should not, imply that certain embodimentsrequire at least one of X, at least one of Y, or at least one of Z toeach be present.

It should be emphasized that the above-described embodiments of thepresent disclosure are merely possible examples of implementations setforth for a clear understanding of the principles of the disclosure.Many variations and modifications can be made to the above-describedembodiments without departing substantially from the spirit andprinciples of the disclosure. All such modifications and variations areintended to be included herein within the scope of this disclosure andprotected by the following claims.

Therefore, the following is claimed:
 1. A method, comprising: placing afirst rigid layer of a transaction card within a first recess of a firstmetallic sheet, the first recess comprising a lip and an opening;placing a binding layer on top of the first rigid layer of thetransaction card, the binding layer comprising a binding medium; placinga second rigid layer on top of the binding layer; placing a secondmetallic sheet on top of the first metallic sheet, the second metallicsheet having a second recess with a lip and an opening; fusing the firstmetallic sheet together with the second metallic sheet to form a fusedmetal sheet; and cutting the fused metal sheet along a border of theopening of the first recess.
 2. The method of claim 1, furthercomprising placing an antenna between the first rigid layer and thesecond rigid layer.
 3. The method of claim 2, further comprisingconnecting the antenna to an integrated circuit chip via a contact pad.4. The method of claim 1, further comprising affixing an integratedcircuit chip within a pocket of the second rigid layer.
 5. The method ofclaim 4, wherein affixing the integrated circuit chip further comprises:depositing an adhesive within the pocket of the second rigid layer;placing the integrated circuit chip on top of the adhesive; and curingthe adhesive.
 6. The method of claim 4, further comprising inductivelycoupling the integrated circuit chip to an antenna.
 7. The method ofclaim 1, further comprising cutting the fused metal sheet along a borderof the opening of the second recess.
 8. The method of claim 1, furthercomprising affixing a magnetic stripe to an interior surface of thefirst rigid layer of the transaction card.
 9. The method of claim 1,further comprising affixing a magnetic stripe to an exterior surface ofthe first rigid layer.
 10. The method of claim 1, wherein the firstrigid layer and the second rigid layer comprise a chemicallystrengthened glass.
 11. A transaction card manufactured by a processcomprising: placing a first rigid layer of a transaction card within afirst recess of a first metallic sheet, the first recess comprising alip and an opening; placing a binding layer on top of the first rigidlayer of the transaction card, the binding layer comprising a bindingmedium; placing a second rigid layer on top of the binding layer;placing a second metallic sheet on top of the first metallic sheet, thesecond metallic sheet having a second recess with a lip and an opening;fusing the first metallic sheet together with the second metallic sheetto form a fused metal sheet; and cutting the fused metal sheet along aborder of the opening of the first recess.
 12. The transaction cardmanufactured by the process of claim 11, further comprising placing anantenna between the first rigid layer and the second rigid layer. 13.The transaction card manufactured by the process of claim 12, furthercomprising connecting the antenna to an integrated circuit chip via acontact pad.
 14. The transaction card manufactured by the process ofclaim 11, further comprising affixing an integrated circuit chip withina pocket of the second rigid layer.
 15. The transaction cardmanufactured by the process of claim 14, wherein affixing the integratedcircuit chip further comprises: depositing an adhesive within the pocketof the second rigid layer; placing the integrated circuit chip on top ofthe adhesive; and curing the adhesive.
 16. The transaction cardmanufactured by the process of claim 11, further comprising cutting thefused metal sheet along a border of the opening of the second recess.17. The transaction card manufactured by the process of claim 11,further comprising affixing a magnetic stripe to an interior surface ofthe first rigid layer of the transaction card.
 18. The transaction cardmanufactured by the process of claim 11, further comprising affixing amagnetic stripe to an exterior surface of the first rigid layer.
 19. Thetransaction card manufactured by the process of claim 11, wherein thefirst rigid layer and the second rigid layer comprise a chemicallystrengthened glass.
 20. A transaction card, comprising: a first rigidlayer having a first external surface and a first internal surface; asecond rigid layer having a second external surface and a secondinternal surface; a binding layer between the first internal surface ofthe first rigid layer and the second internal surface of the secondrigid layer, the binding layer comprising a binding medium; a pocketwithin the first external surface of the first rigid layer; anintegrated circuit chip affixed within the pocket of the first rigidlayer; and a metallic rim extending around an edge of the transactioncard, the metallic rim comprising a first lip adjacent to the firstexternal surface of the first rigid layer and a second lip adjacent tothe second external surface of the second rigid layer.